Articles
  • Fabrication of micro-conductive patterns on glass surfaces using a laser direct writing method
  • Bong-Gu Lee*
  • School of Mechanical Engineering, Yonsei University 134 Shinchon-dong, Seodaemun-gu, Seoul 120-749, Korea
Abstract
A micro-conductive pattern was fabricated on an insulating substrate (SiO2) surface using a direct laser writing method known as laser-induced forward transfer (LIFT). The LIFT process, employing a multi-scan mode laser, fabricated the microconductive pattern using an electroless nickel plating procedure as a method for improving the deposition process of the seed pattern on the insulating substrate surface and the electrical conductivity of the pattern. In the multi-scan mode LIFT process, when the laser beam irradiates a thin metal film, the photon energy is absorbed by the film and converted into thermal energy, and the thermal decomposition reaction produced by the resulting heat conduction forms a deposit on the substrate. This paper analyzes the impact of seed pattern formation by LIFT, and the impact of key variables in the electroless nickel plating process, on the micro-conductive pattern fabrication, using scanning electron microscopy (SEM) and an optical microscope. It also examines the impact of the process variables on the cross-sectional shape and surface quality of the deposited pattern.

Keywords: Laser induced forward transfer (LIFT), Laser direct writing, Microdeposition, Electroless nickel plating, Deed layer, Micro patterning.

This Article

  • 2009; 10(6): 729-738

    Published on Dec 31, 2009

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