Articles
  • Study on the scratching force surface damage morphology of SiCf/SiC composites by single abrasive grain with ultrasonic assistance

  • Xuezhi Wanga,b,c,*, Hanying Wanga,c, Ming Conga,b, Wenbo Fand and Na Yuane,*

  • aSchool of Mechatronics Engineering, Shenyang Aerospace University, Shenyang 110136, China
    bAECC Shenyang Liming Aero-Engine Co., LTD, Shenyang 110043, China
    cKey Laboratory of Rapid Development & Manufacturing Technology for Aircraft (Shenyang Aerospace University), Ministry of Education, Shenyang 110136, China
    dTeaching and Research Support Center Army Artillery and Air Defense Forces Academy, Shenyang 110065, China
    eSchool of Information and Control Engineering, Liaoning Petrochemical University, Fushun 113001, China

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Continuous silicon carbide fiber reinforced silicon carbide matrix composites (SiCf/SiC) are used in many different industries, including aerospace, due to their high hardness, high temperature, and resistance to oxidation, corrosion, and wear. However, when machining SiCf/SiC composites, problems such as matrix rupture, edge chipping, fiber warping and pull-out, and tool wear are prone to occur. This paper conducts a finite element scratching simulation study on SiCf/SiC composites, which is validated through experiments to investigate the matrix and fiber damage destruction mechanism and to meet the demand for high-quality, high-efficiency machining of SiCf/SiC composite structural components. Findings indicate that the scratching force increases with scratching speed, scratching depth, and ultrasonic amplitude increase. However, with the rise of the scratching angle, the scratching force tends to increase and then decrease. In addition, single-particle scratching experiments showed that matrix fragmentation, fiber breakage, fiber debonding and detachment, and matrix debonding between fibers were the primary manifestations of SiCf/SiC composite damage. In the case of ultrasonic vibration scratching, the scratch morphology is high-frequency impact scratches, and the vertical fiber fracture is neat. These findings clarify the fundamental damage and removal mechanisms of SiCf/SiC composites and provide a useful reference for optimizing machining parameters to enhance processing quality and efficiency.


Keywords: SiCf/SiC composites, Ultrasonic-assisted grinding, Grinding mechanism, Abaqus finite element simulation.

This Article

  • 2025; 26(6): 950-962

    Published on Dec 31, 2025

  • 10.36410/jcpr.2025.26.6.950
  • Received on Jul 21, 2025
  • Revised on Sep 23, 2025
  • Accepted on Oct 3, 2025

Correspondence to

  • Xuezhi Wang a,b,c, Na Yuan e

  • aSchool of Mechatronics Engineering, Shenyang Aerospace University, Shenyang 110136, China
    bAECC Shenyang Liming Aero-Engine Co., LTD, Shenyang 110043, China
    cKey Laboratory of Rapid Development & Manufacturing Technology for Aircraft (Shenyang Aerospace University), Ministry of Education, Shenyang 110136, China
    eSchool of Information and Control Engineering, Liaoning Petrochemical University, Fushun 113001, China
    Tel : +86-24-89728447 Fax: +86-24-89728447

  • E-mail: wangxuezhineu@126.com (Xuezhi Wang), yuanna2020@12