Articles
  • Thermal shock resistance of porous alumina ceramics with different internal and external porosity
  • Maochang Caoa, Xinxin Jina,*, Le Chena, Limin Donga,b, Bo Lic,* and Xianyou Zhanga

  • aSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, P. R. China
    bKey Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, Harbin University of Science and Technology, 150080 Harbin, China
    cCenter for Precision Engineering, Harbin Institute of Technology, Harbin 150001, P.R. China

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Porous alumina ceramics with porosity of 24.42-41.10% were prepared by gel casting process with polymethylmethacrylate microsphere(PMMA) as pore-forming agent. The mechanical/thermal properties and porosity of the obtained ceramic are influenced by two structures that composed of spherical shaped micro pores(external pores) depending on PMMA content and irregular sub-micro pores(internal pores) formed by the stacking of ceramic particles. Mechanical properties and thermal conductivity decreased as the porosity increased. The thermal shock resistance of the samples was excellent when the porosity was 33.45%. This phenomenon caused by the matching of external and internal pores is inconsistent with the trend of thermal shock fracture resistance and thermal shock damage resistance varying with porosity in previous researches. In the case of the same total porosity, the introduction of external pores improved the mechanical properties and critical temperature difference, reduced the thermal conductivity and fracture surface energy that affected the thermal stability of the material.


Keywords: porous ceramics, porosity, thermal conductivity, thermal shock resistance

This Article

  • 2021; 22(4): 377-385

    Published on Aug 31, 2021

  • 10.36410/jcpr.2021.22.4.377
  • Received on Jun 20, 2020
  • Revised on Sep 22, 2020
  • Accepted on Oct 2, 2020

Correspondence to

  • Xinxin Jin a, Bo Li c
  • aSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, P. R. China
    cCenter for Precision Engineering, Harbin Institute of Technology, Harbin 150001, P.R. China
    Tel : +86-451-86392501 Fax: +86-451-86392501

  • E-mail: au.zn.zn@163.com (X.-X. Jin), waymlbwd8651@126.com