Articles
  • Crack self-healing behavior in silicon carbide composite ceramics to secure structural integrity and improve economics
  • Pete Sihyun Leea, Tae-Ho Ahnb, Sung-Hun Kimc, Hyun-Mi Kimc and Kwang-Bo Shimb,*
  • a Morgan Advanced Materials, 394, Dunchon-daero, Jungwon-gu, Seongnam-si, Gyeonggi-do, Korea b International Sustainable Engineering Materials (ISEM) Center, Ceramic Materials Institute, Hanyang University, Seoul 133-791 Korea c Division of Materials Science and Engineering, 222 Wangsimni-ro, Seongdong-gu, Hanyang University, Seoul 133-791 Korea
Abstract
Structural ceramics are brittle and sensitive to flaws. As a result, the structural integrity of ceramic component may be seriously affected. However some engineering ceramics have the ability to healing the crack that is considerable advantages can be expected. In this review, the structural ceramics and its structure, parts processing and physical properties in terms of commercial products that are using today. Crack-healing behavior and mechanism was investigated in different silicon carbide based materials; alumina, mullite, silicon nitride, aluminum nitride, and zirconium debride. To find self-healing conditions in economical way for commercial structural ceramics, self-healing parameters are reviewed based on silicon carbide composite ceramics; healing temperature, testing temperature, healing atmosphere, crack size, SiC volume fraction, applied healing and testing stress, threshold stress for crack-healing, and fatigue stress. It can be conclude that crack-healing is effective way to increase reliability and lifetime of ceramics, and cost can be dramatically reduced by reducing quality inspection cost and time. Enhancing the self-crack-healing ability is valuable way to expand the usage of SiC ceramics such as engineering parts in extremely hard conditions and advanced semiconductor parts for higher density of circuit.

Keywords: Self-healing, Crack-healing, Silicon carbide, Silicon nitride, Aluminum nitride, Mullite.

This Article

  • 2015; 16(S1): 114-131

    Published on Nov 15, 2015

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